BIOGRAPHY

Roman Genov received the B.S. degree in Electrical Engineering from Rochester Institute of Technology, NY in 1996 and the M.S.E. and Ph.D. degrees in Electrical and Computer Engineering from The Johns Hopkins University, Baltimore, MD in 1998 and 2003 respectively.

Prof. Genov held engineering positions at Atmel Corporation, Columbia, MD in 1995 and Xerox Corporation, Rochester, NY in 1996. He was a visiting researcher in the Laboratory of Intelligent Systems at Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland in 1998 and in the Center for Biological and Computational Learning at Massachusetts Institute of Technology, Cambridge, MA in 1999. He is presently a Full Professor in the Department of Electrical and Computer Engineering at the University of Toronto, Canada, where he is a member of the Electronics Group (Chair) and the Biomedical Engineering Group, and the Director of Intelligent Sensory Microsystems Laboratory.

Prof. Genov’s research interests are primarily in analog/digital integrated circuits and systems for energy-constrained biological, medical, and consumer sensory applications, such as implantable, wearable and disposable sensory microsystems, sensory-edge machine learning accelerators and wireless sensors; applications include brain-chip interfaces, neuro-stimulators, image sensors, and molecular biosensors.

Prof. Genov is a co-recipient of Jack Kilby Award for Outstanding Student Paper at IEEE International Solid-State Circuits Conference, Best Paper Award of IEEE Transactions on Biomedical Circuits and Systems, Best Paper Award of IEEE Biomedical Circuits and Systems Conference, Best Student Paper Award of IEEE International Symposium on Circuits and Systems, Best Paper Award of IEEE Circuits and Systems Society Sensory Systems Technical Committee, Brian L. Barge Award for Excellence in Microsystems Integration, MEMSCAP Microsystems Design Award, DALSA Corporation Award for Excellence in Microsystems Innovation, and Canadian Institutes of Health Research Next Generation Award.

He was a member of IEEE International Solid-State Circuits Conference (ISSCC) International Program Committee and IEEE European Solid-State Circuits Conference (ESSCIRC) Technical Program Committee, and served as a Technical Program Co-chair at IEEE Biomedical Circuits and Systems Conference. He was also an Associate Editor of IEEE Transactions on Circuits and Systems-II: Express Briefs and IEEE Signal Processing Letters, as well as a Guest Editor for IEEE Journal of Solid-State Circuits. Currently he is an Associate Editor of IEEE Transactions on Biomedical Circuits and Systems.

Prof. Genov is a co-author of over 200 papers, including 12 papers at the prestigious ISSCC (‘The Olympics of Chip Design’) and 5 papers at the Symposium on VLSI Circuits (Top-2 conference in chip design).